Results for: TFX03L
in Thermal Management
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Thermal Management
Heat generated by electronic devices and circuitry must be dissipated to improve reliability and prevent premature failure. Techniques for heat dissipation can include heatsinks and fans for air cooling, and other forms of computer cooling such as liquid cooling. In cases of extreme low environmental temperatures, it may actually be necessary to heat the electronic components to achieve satisfactory operation.
Thermal Management > ESD Suppressors
| Part No. | DS | Manufacturer | D/C | Qty | Region | Action |
|---|---|---|---|---|---|---|
| GBLC03-LF-T7 |  |
ProTek | 200752 | 3000 | Denmark | Request A Quote |
| GBLC03-LF-T7 | |
ProTek | 2024+ | 22500 | China | Request A Quote |
| GBLC03-LF-T7 | |
ProTek | 2023+ | 33450 | China | Request A Quote |
| GBLC03-LF-T7 | |
ProTek | 200745+ | 8980 | Japan | Request A Quote |
| GBLCSC03-LF-T74 | |
ProTek | 2023+ | 45670 | China | Request A Quote |
| GBLCSC03-LF-T74 | |
ProTek | 2009+ | 2535 | Japan | Request A Quote |
| GBLCSC03-LF-T74 | |
ProTek | - | 3200 | China | Request A Quote |
| GBLCSC03-LF-T74 | |
ProTek | 2024+ | 13500 | China | Request A Quote |
| GBLCSC03-LF-T74 | |
ProTek | - | 3435 | Canada | Request A Quote |