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Thermal Management

Heat generated by electronic devices and circuitry must be dissipated to improve reliability and prevent premature failure.Techniques for heat dissipation can include heatsinks and fans for air cooling, and other forms of computer cooling such as liquid cooling. In cases of extreme low environmental temperatures, it may actually be necessary to heat the electronic components to achieve satisfactory operation. Thermal management measures must be taken to accommodate high heat release equipment in telecommunications rooms. Generic supplemental/spot cooling techniques, as well as turnkey cooling solutions developed by equipment manufacturers are viable solutions. Such solutions could allow very high heat release equipment to be housed in a central office that has a heat density at or near the cooling capacity available from the central air handler. According to Telcordia GR-3028, Thermal Management in Telecommunications Central Offices, the most common way of cooling modern telecommunications equipment internally is by utilizing multiple high-speed fans to create forced convection cooling. Although direct and indirect liquid cooling may be introduced in the future, the current design of new electronic equipment is geared towards maintaining air as the cooling medium.

Circuit Protection > Thyristors > Thyristor Surge Protection Devices

型号	DS	厂牌	批号	数量	地区	采购
P3100SCLRP		Littelfuse	2011+	2309	西班牙	要求报价
P3100SCLRP		Littelfuse	-	398	以色列	要求报价
P3100SCLRP		Littelfuse	201829	7500	美国	要求报价
P3100SCLRP		Littelfuse	-	6515	德国	要求报价
P3100SCLRP		Littelfuse	201114	1910	美国	要求报价
P3100SCLRP		Littelfuse	-	17034	中国	要求报价
P3100SCLRP		Littelfuse	-	10000	香港	要求报价
P3100SCLRP		Littelfuse	-	2388	德国	要求报价
P3100SCLRP		Littelfuse	2012+	376	日本	要求报价
P3100SCLRP		Littelfuse	2018+	823	中国	要求报价
P3100SCLRP		Littelfuse	2014+	2140	中国	要求报价
P3100SCLRP		Littelfuse	-	238	韩国	要求报价
P3100SCLRP		Littelfuse	2008	225	中国	要求报价
P3100SCLRP		Littelfuse	-	30000	台湾	要求报价
P3100SCLRP		Littelfuse	200604	2403	西班牙	要求报价

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